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Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-1: Pull strength test standard by International Electrotechnical Commission, 07/11/2007
The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
Product Details
Edition:
1.0
Published:
07/11/2007
Number of Pages:
30
File Size:
1 file , 1000 KB
Note:
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