IEC 61192-3 Ed. 1.0 b – Workmanship requirements for soldered electronic assemblies – Part 3: Through-hole mount assemblies
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
Product Details
Edition:
1.0
Published:
12/17/2002
Number of Pages:
93
File Size:
1 file , 7.3 MB
Note:
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