IEC 61190-1-3 Ed. 1.0 b:2002

Attachment materials for electronic assembly – Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
standard by International Electrotechnical Commission, 03/22/2002

Category: IEC

Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).