IEC 61189-2-807 Ed. 1.0 b

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition temperature (Td) using TGA

Published by	Publication Date	Number of Pages
IEC	09/01/2021	22

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Category: IEC

IEC 61189-2-807 Ed. 1.0 b – Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition temperature (Td) using TGA

This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td)
of base laminate materials using thermogravimetric analysis (TGA).