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Semiconductor devices – Mechanical and climatic test methods – Part 32: Flammability of plastic-encapsulated devices (externally induced) standard by International Electrotechnical Commission, 08/30/2002
Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device.
Product Details
Edition:
1.0
Published:
08/30/2002
Number of Pages:
9
File Size:
1 file , 350 KB
Note:
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