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Mechanical standardization of semiconductor devices – Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FL
IEC 60191-6-22 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FL
IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
Product Details
Edition:
1.0
Published:
12/11/2012
Number of Pages:
34
File Size:
1 file , 380 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
