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Mechanical standardization of semiconductor devices – Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline packages (SOP)
IEC 60191-6-21 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline packages (SOP)
IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
Product Details
Edition:
1.0
Published:
08/30/2010
Number of Pages:
28
File Size:
1 file , 420 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
