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Mechanical standardization of semiconductor devices – Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) standard by International Electrotechnical Commission, 06/27/2007
This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (“FBGA” hereafter) and Fine-pitch Land Grid Array (“FLGA” hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.
Product Details
Edition:
1.0
Published:
06/27/2007
Number of Pages:
15
File Size:
1 file , 250 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
