This Test Method establishes a uniform method for performing component package power cycling stress test. This specification covers power induced temperature cycling of a packaged component, simulating the non-uniform temperature distribution resulting from a device powering on and off in the application.
Product Details
Published:
08/01/2007
Number of Pages:
17
File Size:
1 file , 140 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
