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Environmental testing: Tests — Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste standard by Japanese Industrial Standard / Japanese Standards Association, 01/01/2005
JIS C 0099 – Environmental testing: Tests — Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
Product Details
Published:
01/01/2005
File Size:
1 file , 1.5 MB
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