ASTM F3192 – Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization
1.1 This specification details the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced packaging.
Product Details
Published:
09/01/2016
Number of Pages:
5
File Size:
1 file , 110 KB
Note:
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