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Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
BS 4584-103.1 – Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
Two types of epoxide resin impregnated woven glass fabric with the resin cured to B stage.
Cross References: BS 4584:Part 1
Product Details
Published:
02/28/1990
ISBN(s):
0580181723
Number of Pages:
12
File Size:
1 file , 830 KB
Product Code(s):
00209121, 00209121, 00209121
Note:
This product is unavailable in Ukraine, Russia, Belarus
