$182.00Original price was: $182.00.$109.00Current price is: $109.00.
Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION
IEC 60191-4 Ed. 2.2 b – Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION
Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages.
Product Details
Edition:
2.2
Published:
10/22/2002
Number of Pages:
43
File Size:
1 file , 610 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
