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Mechanical standardization of semiconductor devices – Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Dimensions of P-VSON standard by International Electrotechnical Commission, 11/19/2003
Provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (P-VSON).
Product Details
Edition:
1.0
Published:
11/19/2003
Number of Pages:
12
File Size:
1 file , 610 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
