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Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ)
IEC 60191-6-20 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline J-lead packages (SOJ)
IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.
Product Details
Edition:
1.0
Published:
08/30/2010
Number of Pages:
21
File Size:
1 file , 580 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
