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Mechanical standardization of semiconductor devices – Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of quad flat packs (QFP)
IEC 60191-6-3 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of quad flat packs (QFP)
IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.
Product Details
Edition:
1.0
Published:
09/29/2000
Number of Pages:
34
File Size:
1 file , 320 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
