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Mechanical standardization of semiconductor devices – Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA)
IEC 60191-6-4 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA)
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
Product Details
Edition:
1.0
Published:
06/11/2003
Number of Pages:
32
File Size:
1 file , 480 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
