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Solderless connections – Part 5: Press-in connections – General requirements, test methods and practical guidance standard by International Electrotechnical Commission, 01/10/2008
Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Changes with respect to the previous edition deal with: use of four layer test boards; sample tolerance range requirements; use of platings other than tin or tin/lead.
Product Details
Edition:
3.0
Published:
01/10/2008
Number of Pages:
72
File Size:
1 file , 1.1 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus
