IEC 60749-3 Ed. 2.0 en:2017
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Semiconductor devices – Mechanical and climatic test methods – Part 3: External visual examination
standard by International Electrotechnical Commission, 03/03/2017
IEC 60749-3:2017(E) is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.
Product Details
- Edition:
- 2.0
- Published:
- 03/03/2017
- Number of Pages:
- 11
- File Size:
- 1 file , 290 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
