IEC 60749-30 Ed. 1.0 b:2005
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Semiconductor devices – Mechanical and climatic test methods – Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
standard by International Electrotechnical Commission, 01/20/2005
Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.
Product Details
- Edition:
- 1.0
- Published:
- 01/20/2005
- Number of Pages:
- 27
- File Size:
- 1 file , 380 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
