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Semiconductor devices – Mechanical and climatic test methods – Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
IEC 60749-30 Ed. 2.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
Product Details
Edition:
2.0
Published:
08/17/2020
Number of Pages:
26
File Size:
1 file , 1.1 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus
