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Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2: Test methods for materials for interconnection structures
IEC 61189-2 Ed. 2.0 en – Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2: Test methods for materials for interconnection structures
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
Product Details
Edition:
2.0
Published:
05/30/2006
Number of Pages:
122
File Size:
1 file , 1.2 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus
