$51.00Original price was: $51.00.$31.00Current price is: $31.00.
Semiconductor devices – Micro-electromechanical devices – Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods
IEC 62047-16 Ed. 1.0 b – Semiconductor devices – Micro-electromechanical devices – Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods
IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
Product Details
Edition:
1.0
Published:
03/05/2015
Number of Pages:
21
File Size:
1 file , 420 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
