IEC 62374-1 Ed. 1.0 b – Semiconductor devices – Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
Product Details
Edition:
1.0
Published:
09/29/2010
Number of Pages:
32
File Size:
1 file , 490 KB
Note:
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