IEC 62418 Ed. 1.0 b – Semiconductor devices – Metallization stress void test
IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
Product Details
Edition:
1.0
Published:
04/22/2010
Number of Pages:
34
File Size:
1 file , 990 KB
Note:
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