This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance.
Product Details
Published:
03/01/2011
Number of Pages:
18
File Size:
1 file , 770 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
