IPC 2251 PDF

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Design Guide for the Packaging of High Speed Electronic Circuits

Published by Publication Date Number of Pages
IPC 11/01/2003 99
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Description

IPC 2251 – Design Guide for the Packaging of High Speed Electronic Circuits

This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered stripline and dual stripline geometries, expanded EMI layout practices, signal integrity design constraints, enhanced graphics and updated terms and definitions.

Product Details

Published:
11/01/2003
Number of Pages:
99
File Size:
1 file , 1 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus