IPC 6801 PDF

$68.00

Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards

Published by Publication Date Number of Pages
IPC 01/01/2000 41
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Description

IPC 6801 – Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards

Recognizing Japan’s leadership in microvia substrate production, the IPC HDI Committee chose to adopt JPCA-BU01 as IPC/JPCA-6801. The adoption of this document is a part of the ongoing efforts of the IPC HDI Committee and JPCA Build-Up PWB Committee to ensure global consistency in the terminology, requirements and test methods for HDI and microvia applications. IPC/JPCA-6801 lists terms specific to HDI and test methods for CTE for materials and HDI PWBs, peel strength and thermal shock. Also included is a design criteria table and background information for the development of a standard for HDI PWBs.

Product Details

Edition:
1st
Published:
01/01/2000
ISBN(s):
1580982395
Number of Pages:
41
File Size:
1 file , 430 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus