IPC HM-860 PDF

$101.00

Specification for Multilayer Hybrid Circuits

Published by Publication Date Number of Pages
IPC 01/10/1987 66
PDF FormatPDF FormatMulti-User-AccessMulti-User AccessPrintablePrintableOnline downloadOnline Download
Category:

Description

IPC HM-860 – Specification for Multilayer Hybrid Circuits

Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements.

Product Details

Published:
01/10/1987
Number of Pages:
66
File Size:
1 file , 550 KB
Product Code(s):
HM-860(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus