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Mechanical standardization of semiconductor devices – Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 60191-6-2 Ed. 1.0 en – Mechanical standardization of semiconductor devices – Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages.
Product Details
Edition:
1.0
Published:
12/11/2001
Number of Pages:
10
File Size:
1 file , 260 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
