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Mechanical standardization of semiconductor devices – Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for fine pitch land grid array (FLGA) standard by International Electrotechnical Commission, 03/22/2001
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
Product Details
Edition:
1.0
Published:
03/22/2001
Number of Pages:
12
File Size:
1 file , 120 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
