IEC 63011-1 Ed. 1.0 b – Integrated circuits – Three dimensional integrated circuits – Part 1: Terminology
IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.
Product Details
Edition:
1.0
Published:
11/28/2018
Number of Pages:
24
File Size:
1 file , 1.3 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus
